SND-MDW Professional Synthetic Micron Diamond Powder For Silicon Wafer Cutting Diamond Wire

I-SND-MDW yobuchwephesha be-Synthetic Micron yeDayimane yomgubo yeSilicon wafer yokusika ucingo lwedayimani oFakelweyo

inkcazelo emfutshane:

I-SND-MDW Professional Synthetic Micron Diamond Powder For Silicon Wafer Cutting Diamond Wire 1. Micron Diamond Powder Intshayelelo I-SND-MDW inomlinganiselo ophezulu we-blocky we-crystal shape, ukusabalalisa ubungakanani be-particle, ubukhulu be-particle Uniform kunye nokuma.Ilungiselelwe ngokukodwa ukwenza i-silicon wafer yokusika ucingo lwedayimani, isarha yobucwebe, isarha ye-semiconductor.2. Ukucaciswa kweMicron Diamond Powder SND-M05 0-0.125~40-60 SND-M10 0-0.125~40-60 SND-M15 0-0.125~40-60 Irregul...

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

SND-MDW Professional Synthetic Micron Diamond Powder For Silicon Wafer Cutting Diamond Wire

1. Intshayelelo ye-Micron Diamond powder

I-SND-MDW inomlinganiselo ophezulu we-blocky crystal shape, ukusabalalisa ubungakanani be-particle egxininisiweyo, ubungakanani be-particle kunye nemilo.Ilungiselelwe ngokukodwa ukwenza i-silicon wafer yokusika ucingo lwedayimani, isarha yobucwebe, isarha ye-semiconductor.

2. Ukucaciswa kweMicron Diamond powder


SND-M05 0-0.125~40-60	SND-M10 0-0.125~40-60	SND-M15 0-0.125~40-60
Imilo yekristale engaqhelekanga, umxholo wokungcola kunye neqhekeza ukuhanjiswa kobungakanani, kunokusetyenziswa kwi-resin kunye ne-vitrified bond. Ifanelekile ekusebenzeni okuphezulu ukucola nokupholisha izicelo, njengamatye, iithayile, iJade & gem, njl.	Imilo yekristale engaqhelekanga kunye igxile kakhulu ukuhanjiswa kobungakanani besuntswana, umxholo ophantsi wokungcola.Phezulu ukusebenza kakuhle.Ingasetyenziswa kwi resin, vitrified, metal bond kunye neemveliso ze-electroplated.	Vimba okuziinkozo, ngokwentelekiso ubungakanani bamasuntswana obunzulu ukuhanjiswa, ukungcola okuncinci, i-hydrophilic efanelekileyo ukusebenza.Ifanelekile ukutya okuyimfuneko ephezulu, ukupolisha, ingasetyenziselwa PCD yedayimani ekumgangatho ophezulu ncamathelisa kunye ne-slurry kunye nezinye iimveliso zedayimani ezikumgangatho ophezulu.

SND-M/DW 0-0.125~40-60	SND-M/PCD 0-0.125~40-60	SND-M/PL 0-0.125~40-60
Ubungakanani obufanayo bamasuntswana kunye nokumila. Ukwenza ukusika i-silicone wafer ucingo lwedayimani, isarha yobucwebe, isarha semiconductor.	Yenzelwe ngokukodwa Isicelo sePCD/PDC, siphezulu amandla blocky crystal imilo, ubungakanani bamasuntswana obunzulu ukusasazwa, ukungcola okuphantsi kakhulu, isiqulatho esiphantsi Si, thermal elungileyo ukuzinza kunye nokumelana nokugqoka. Kananjalo ingasetyenziswa phezulu umgangatho metal bond, vitrified bond kunye electroplated iimveliso.	Idayimani enjengePoly ine uphawu olufanayo njenge diamond polycrystalline, kodwa ixabiso eliphantsi.Yenziwe nge yahlelwa micron diamond, nge unyango olulodwa lwekhemikhali, idayimani enjenge-poly-efana nayo imiphetho yokungasebenzi kakuhle, le miphetho yencindi yobusi nceda umphezulu wokumenyezelisa uphume kwemikrwelo.

3. Micron Diamond Available Grit Ubungakanani

Umgangatho wamazwe ngamazwe	Umgangatho waseTshayina	Ubungakanani beMesh	Isicelo
0-0.1	W0.1	100000	Super Mirror Ukupholisha
0.0.25	W0.25	60000	Super Mirror Ukupholisha
0-0.5	W0.5	30000	Ukuhombisa isipili
0-1	W1	15000	Ukuhombisa isipili
0-2	W1.5-	13000	Ukucwenga kakuhle
1-2	W1.5	12000	Ukucwenga kakuhle
1-3	W2.5	10000	Ukucwenga kakuhle
2-4	W3.5	6500	Ukucwenga kakuhle
2-5	W4	5000	Ukucwenga kakuhle
3-6	W5	4000	Ukucwenga kakuhle
4-6	W6	3500	Ukucwenga kakuhle
4-8	W7	3000	Ukucwenga okuqhelekileyo
4-9	W10	2500	Ukucwenga okuqhelekileyo
5-10	W10	2000	Ukucwenga okuqhelekileyo
6-12	W10	1800	Ukucwenga okuqhelekileyo
8-12	W12	1600	Ukucwenga okuqhelekileyo
7-14	W14	1500	Ukucwenga okuqhelekileyo
8-16	W14	1300	Ukucwenga okuqhelekileyo
10-20	W20-	1200	Ukucwenga okuqhelekileyo
12-22	W20	1000	Ukucwenga okuqhelekileyo
15-25	W20+	800	Ukucwenga okuqhelekileyo
20-30	W28	700	Ukucwenga okuqhelekileyo
22-36	W28+	600	Ukugaya rough
20-40	W40-	500	Ukugaya rough
30-40	W40	450	Ukugaya rough
35-45	W40+	400	Ukugaya rough
36-54	W50	350	Ukugaya rough
D46	325/400	320	Ukugaya rough
D54	270/325	270	Ukugaya rough
D64	230/270	230	Ukugaya rough
D76	200/230	200	Ukugaya rough

4. Olunye ubungakanani begrit yeCoarse

SND-G05	50/60-325/400	Umbala oluhlaza okhanyayo, ubume obungaqhelekanga kunye nobunzima obuphantsi.Ngokubanzi esetyenziselwa ukulungisa amatye, iikhonkrithi, iiseramics, njl.
SND-G10	30/35-325/400	Umbala otyheli, imilo engaqhelekanga kunye nobunzima obuqhelekileyo, Ifakwe kuyo i-ceramic edibeneyo, i-resin edibeneyo kunye nazo zonke iintlobo ze-electroplating iimveliso, zamatye okucubungula, i-alloy eqinile, izinto eziphathekayo, idayimani yendalo, gem.
I-SND-G15	30/35-325/400	Umbala ophuzi, ubunzima obuphezulu kunye nokuqina.Isetyenziswe kwi-ceramic bond,resin bond kunye nazo zonke iintlobo zeemveliso electroplating, ingaba isetyenziselwa ukusetyenzwa komsebenzi onzima kwi-carbide, iglasi, iiseramikhi, ilitye kunye nezinye izinto ezingezo zetsimbi.
SND-G20	80/100-325/400	Umxube weekristali eziqhelekileyo kunye ne-angular, ubunzima obuphakathi ngeekristale ezimile okwebloko.Ilungele ukusetyenziswa kwe izixhobo eziphezulu zedayimani.
SND-G30	80/100-325/400	Ubunzima obuphakathi ngeshpe yedayimane engcono.Ifanelekile i izixhobo diamond beveling glass okanye crystal, ukugaya carbide kunye izixhobo zemagnethi, njl.
SND-G40	80/100-325/400	Ubunzima obuphakathi obuphezulu obunemilo eqhelekileyo, i-thermal ephezulu uzinzo kunye nokumelana nempembelelo.Ifakwe ukwenza ukucola & amavili abrasives ukucubungula izinto zomthwalo ophakathi, njenge ukomba ongundoqo weglasi, ukuhombisa ipensile, kunye nokukrola ukuhombisa iglasi kunye nekristale.
SND-G60	80/100-325/400	Iminye imilo ye-cubooctahedral, amandla empembelelo ephezulu kunye ukuzinza kwe-thermal.Ifakwe kwimeko efuna ukugaya okuphezulu ireyithi, njengezixhobo ezifakwe kwi-electroplated zokugaya kunye namatye epolisha, iiseramikhi, iiglasi, kunye nezixhobo zemagneti, njl.